![\"\"](\"https:\/\/test.brandner.ee\/wp-content\/uploads\/2017\/10\/LayerCount.png\")
<\/p>\nHere one can compile constructions that use buried and\/or blind vias. Brandner Electronics makes blind vias through mechanical drilling. The following example uses a 4-layered PCB. First, choose the final number of board layers:<\/p>\n
<\/p>\n
Then determine the structure of blind and\/or buried vias.<\/p>\n
In order to add blind vias from the top layer (TOP;layer 1) to the first internal layer (layer 2), choose the following structure:<\/p>\n
![\"\"](\"https:\/\/test.brandner.ee\/wp-content\/uploads\/2017\/10\/BlindFmTop.png\")
<\/p>\n
In order to drill blind vias from the bottom layer (BOT; layer 4) to the bottom internal layer (layer 3), choose the following:<\/p>\n
![\"\"](\"https:\/\/test.brandner.ee\/wp-content\/uploads\/2017\/10\/BlindFmBot.png\")
<\/p>\n
In order to make blind vias from both top and bottom layers (TOP; layer 1; BOT; layer 4), use the following structure:<\/p>\n
![\"\"](\"https:\/\/test.brandner.ee\/wp-content\/uploads\/2017\/10\/BlindTopBot.png\")
<\/p>\n
In the case of buried vias, please note that buried vias can currently only exist between the outermost internal layers, which, in the case of a 4-layered PCB, means layers 2 and 3; in the case of a 6-layered PCB, layers 2 and 5, etc.<\/p>\n
To make a build up with blind and buried vias, choose the following construction solution:<\/p>\n
![\"\"](\"https:\/\/test.brandner.ee\/wp-content\/uploads\/2017\/10\/BlindAndBuried.png\")
<\/p>\n
Next, choose the minimum drill diameter for both buried and blind vias. Please note that the blind via aspect ratio \u2013 i.e. drilling depth divided by drill diameter \u2013 cannot exceed 1:1! If the aspect ratio is exceeded, the program displays an error message.<\/p>\n
![\"\"](\"https:\/\/test.brandner.ee\/wp-content\/uploads\/2017\/10\/BlindDrill.png\")
<\/p>\n
You can see the results on the graphic depiction of the package on the right:<\/p>\n
![\"\"](\"https:\/\/test.brandner.ee\/wp-content\/uploads\/2017\/10\/ViaGraphEng.png\")
<\/p>\n
Next, you can replace internal and prepregs or choose the construction suitable for your design. Don\u2019t forget to save the package and send it to Brandner Electronics along with your order.<\/p>\n","protected":false},"excerpt":{"rendered":"
Here one can compile constructions that use buried and\/or blind vias. Brandner Electronics makes blind vias through mechanical drilling. The following example uses a 4-layered PCB. First, choose the final number of board layers: Then determine the structure of blind and\/or buried vias. In order to add blind vias from the top layer (TOP;layer 1) …<\/p>\n","protected":false},"author":31,"featured_media":0,"parent":999,"menu_order":150,"comment_status":"closed","ping_status":"closed","template":"template_content-sidebar.php","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-1020","page","type-page","status-publish","hentry"],"acf":[],"yoast_head":"\n